Assembly Machine SAF03 for Glass- und Ceramic-Fuses

The rotary table machines SAF03 assemble glass- and ceramic-fuses from a glass/ceramic body, two pre-tinned caps and a fuse-wire.


A sand filling unit can operate optionally.


By using an inductive high-frequency heating unit for soldering the caps, no hot air and no flux is necessary.



Ultrasonic Welding System USS01

Our Ultrasonic Welding System USS01 uses two six-axis jointed-arm robots to process the plastic parts. Each robot is equipped with an unltrasonic welding tool and the welding process is easily customizable.



Assembly System for TR5 and TE5 Fuses

Our Fuse Assembly System FAS produces TR5 and TE5 fuses at production rates up to 10.000 pcs/h using an advanced and cost efficient tin-free assembly technology.


The base parts come from a vibratory feeder and are sorted into production magazines. A wire feeding system inserts and cuts eight lead wires simultaneously, then the leads are flattened and formed. The fuse element is loaded and crimped to a 24-elements stack before it gets cut and fixed by a high-precision laser system. The soldering process is implemented by a very cost efficient tin-free technology.


A testing device checks every part at the end of the assembly process. In the end, the fuses are equipped with a sand filled cap and the magazines are emptied. The empty magazines return to the feeding unit automatically. The whole production line is protected by a safety light curtain.


Two vision systems observe the production. The machine is controlled by a powerful PLC, the laser and vision systems are handled by a PC. 

TE fuses and fuse element:

Blade Fuse Assembly Line

Skiving Machine, Type FES

Our Skiving Machines Type FES trim the thickness of a zinc band according to the requested dimension. Each current rating needs a specified thickness and shape of the fuse element. The FES skives the required zinc band with three cutters. The first one cuts off the top side. The second one cuts off most of the material at the lower side and finally the third cutter gives the band the high accurate thickness. At the end of the process a highly accurate measuring system checks the skived dimension. The processed band is winded up to a spool.

Skived zinc band and unreeling unit

Punching Machine, Type FEP

Our Punching Machines Type FEP are high speed, high force punching machines for an endless band of fuse elements. The FEP Punching Machines produce fuse elements out of an endless band. The feed of the band is done by servo driven feeding unit. The punching dies may be exchanged easily at a short time. This is necessary to easily adapt the machine to many different types of fuse elements. The output of this machine is an endless band with the punched elements. The zinc band is supplied by one of our Type CWS Unwinding Units. 

Punched fuse elements Type Midi/Mini and punching tool

Blade Fuse Assembly System, Type CFA

The Blade Fuse Assembly System CFA is a fully automatic assembly machine for blade fuses. 

A vibratory feeder transports the housings to the feeding track with the head upright. A set of cylinders separates the housings and stops it at the printing station. A hot stamp system marks each single housing. After marking, the housings come down to the linear feed system. A comb moves the housings to the working stations step by step.

From the rear side of the machine, the punched zinc band is fed in and the fuse elements are inserted into the housing. Therefor a pneumatic driven punching unit cuts the band into single fuse elements. At the next station, the assembled fuses are centered and the leads are aligned. Now the assemble process is finished and the housing is crimped by a high force crimping tool. Finally, the cold resistance is measured. To produce fuses used for PCB applications, a lead cutter can be activated. It cuts the leads to a specified length. Before the fuses arrive the sorting station, the week code is embossed.  Only good fuses get the week code and drop down into the good bin, the bad fuses are ejected into the reject bin.

Blade Fuses Type Midi and Mini

Mini Circuit Breaker Assembly

Wire Forming System, Type WFS

The Wire Forming System WFS forms wires at a very high precision and repeatability. The System WFS can be equipped with various tools to give the wire the requested shape. Band wires are needed for the high current fuse production or for forming protrusions when making contact pads for relays. The machine takes the wire from a standard spool, forms the wire and spools it to a new spool using a layering system. Each flattening unit is driven by a geared AC-motor. The thickness is adjustable continuously at a very high precision and repeatability. The speed of the main feed motor is programmable. A touch panel is used to enter the production data and shows the state of the production. The maximum production rate is 4 meter/minute depending on the wire material and the wire dimensions.

Mini Circuit Breaker Assembly, Type UWS

The System UWS is an assembly machine for miniature single-pole thermal circuit breakers. Based on a turn table the system is equipped with 18 working station. The molded carrier plate is fed to the loading station by a conveyor belt. The loading unit inserts the carrier into the turn table. At the next working station, the short circuit bridge of the carrier plate is cut. The contact pad is fed from a spool by a stepping motor. It transports the formed silver wire to the pad cutting station. Here, the wire is cut into short pieces. A vacuum gripper places the pad onto the carrier plate. A motorized welding head clamps the pad and finally welds it to the carrier plate. The welding system is of the type inverter, which means that the welding current is generated by a transformer at a frequency of 1kHz.

After the pad welding, a resistor must be weld to the carrier plate. The resistor comes from an ammo pack box and is fed by a stepping motor, too. During feeding, the leads of the resistor are cut and the resistor is placed for pick up. A pick and place system picks up the resistor and place it to the weld position. Two smaller weld units weld the leads to the carrier plate. Now the part is assembled and needs to be checked. First a high precision sensor checks the height difference between pad and riveting hole. A vision system checks the position of the resistor and the housing for any damage. In a sorting station bad declared parts are ejected. There are two reject boxes, one for the height rejects and one for the vision rejects. Only good parts are delivered to the transfer station. This station takes the part from the main turntable and puts it to the cut table, which has four stations. The last job is to cut the connection between the leads. Finally the part is placed to the outlet belt. The machine is controlled by an advanced PLC combined with a PC. All the production parameters may be set at the touch screen. A weld monitor program shows and controls the welding process. 

Contact Pad Welding, Type PWS

The Contact Pad Welding System PWS is an add-on unit to a punching machine that welds pieces of a silver wire to a carrier. It can replace the wire forming of System WFS and the contact pad welding of System UWS. 

The Contact Pad Welding System PWS welds pieces of a silver wire to a carrier. The wire is fed by a stepper motor to the cutting nozzle. The carrier is advanced by the punching machine. The welding head is driven by a servo motor. The force of the weld head and the movement is programmable. A high current weld inverter supplies the energy to the weld head and the system is synchronized with the punching machine. 

RFID Glass Tag Production Line

Transponder Assembly Line, Type TAL

The Transponder Assembly Line TAL places and adhesively bonds transponder chips onto their ferrites. 

A dispensing system puts the adhesive on the ferrites, which are fed from a blister tape. At the loading unit the ferrites are loaded from the tape into the magazines. One magazine carries 70 parts. A pick and place system takes out the coils from the blister tape and puts it into the magazines. The magazines go by a conveyor belt to the die bonder, where the chips are placed on the ferrites. After that, the transponders in the magazines are fed to the sealing unit, where the adhesive on the components is cured. Before the magazines are forwarded to the unloading unit, they have to pass the measuring unit, where each part is tested.

Glass Vial Handler, Type VLS

The Glass Vial Handler VLS fills glass tubes into production magazines. The tubes come out of bulk from a vibratory feeder to the sorting station. This unit puts the tubes with the correct orientation to the filling spring. The magazines come from the input buffer, which can be filled on the fly and will store up to 10 units. A conveyor belt transports the magazines to the linear axis for positioning. The linear axis steps the magazines to the filling spring. One by one cavity will be filled. At the outlet of the filling process, there is stack up system to handle up to 10 units. The output buffer is also open and allows to take away the filled magazines during operation. All the actions are controlled by sensors.


Dispensing System, Type MDS

The Dispensing System MDS fills acrylic adhesive into glass vials. The magazines with the glass vials are transported automatically to the filling station. The dispensing head is on a servo  motor driven vertical axis. The whole dispensing head moves to a standby position when it is not in action. This is important for the cleaning process. After the dispensing process, the magazines are moved to the output buffer, which is covered to guarantee, that the adhesive remains liquid. The system is controlled by a PLC. The process timers and counters are programmable.

UV-Curing System, Type UVC

The UV-Curing System UVC is a system to cure UV reactive material. The UV reactive parts have to be put on the receipt on the left hand side of the system and are driven through the UV lightened box to the right hand side via a conveyor belt. If no parts are run through the chamber, the UV lights are switched off.

Glass Sealing System, Type GSS

The Glass Sealing System GSS is a system to close glass tubes using a micro flame. The gas is generated by an integrated system. The glass tubes have to be loaded into a magazine. A stepper motor drives the magazine through the flame by linear slide steps. The step distance is programmable. A PLC controls the system. Process timers and counters are programmable. The system is designed as a semi automatic system. You can follow the production process on the integrated monitor.

Transponder Testing & Packing System, Type TMS

The Transponder Testing & Packing System TMS measures, sorts and packs glass transponders. The transponders are fed to a checking point by a part feeding system. An antenna with an adjustable distance activates the units and reads the data. The data of each transponder is stored into a file together with the lot number and the production data. Bad parts are rejected, the good ones are packed to sets of a programmable size.

Winding Systems

Fuse Winding System, Type FWS

The Fuse Winding System FWS winds an endless, slow blow fuse element. The Fuse Winding System FWS is designed to produce endless, slow blow fuse elements. Glass yarn is fed from the lower part of the machine to the winding unit, where the wire is spiraled onto the yarn. The fuse winding system is made for combination with an untwisting unit or as a stand alone system. The system is easy to convert to different diameters of yarn and wire. The machine is equipped with a PLC and the parameters are programmable via tableau. The system comes with an untwisting unit that is made to untwist the wire winded glass yarn and to reel on the produced fuse element.

3D-Winding System, Type WA

The 3D-Winding System Type WA is designed to wind the z-axis coil of a 3D SMD-transponder. The 3D-Winding System WA is designed to wind the z-axis coil of a three dimension SMD-transponder. This transponder consists of a ferrite core, mounted to a plastic base and three coils. These three coils sense the x, y and z-direction. The WA winds the z-axis and welds the wire to the pads. It is available as a semi automatic machine, but it is prepared to integrate an automatic loading and unloading system.

The machine is equipped with a PLC. The parameter is programmable via a control panel.

SMD Handling and Taping Systems

Die Tape & Retape System, Type TSLP

The Die Tape & Retape System TSLP is designed to tape SMD components or to take out the components from the tape and put it back to the wafer. 


If the taping procedure is selected, the machine takes the components from a wafer, flips it and places it into a tape. The wafer must be placed onto a highly accurate xy-table. It is hold by vacuum. A camera scans the matrix code of the wafer and detects the reference crosses. This information is transferred to the machine controller. After the map file is loaded and the reference run is done, the machine is ready to start taping. A system called die ejector, lifts up the components from the foil and transfers it to the pickup nozzle. The pickup system is a rotary unit with four nozzles driven by two servo motors. The direct drive motor rotates the nozzles while the pick motor moves the nozzle down to the wafer. The nozzles are connected to the vacuum generator. The pick procedure is controlled by a high resolution camera which gives a feedback to the machine controller. This system flips the components. A second rotary system takes the components from the pickup system and transfers it to the tape. Before the component is placed into the tape, a second camera checks the correct position. Only components which are inside the limits are placed into the tape, those which are out of tolerance are ejected into the reject bin. Finally the tape is sealed with a cover tape.


If the reverse process is selected, the component is taken out of a tape. The cover tape is peeled off first. The horizontal system picks the component from the tape and puts it to the pickup system (vertical rotor). For the first step, a high resolution camera measures the position of the component and calculates the deviation. A small rotary system rotates the component to the right position. The x-y deviation is given to the wafer table controller. While the component is moved by another 90 degrees, the wafer table moves to the calculated position. The place motor moves down the nozzle to the wafer and places the component.


The machine is set up on a stone base with shock absorber. All axis are very accurate and highly dynamic to allow a throughput of 10.000 pcs/hour. The machine is controlled by a powerful PLC. The data handling, bar code reader and the connection to a host computer is done by PC.

The vision system for the wafer is PC based. This system gives the position data of the wafer. A second vision system checks the component on the vertical rotor, on the horizontal rotor and the correct placement in the tape. Well designed software handles all these units. This software defines the processes and shows all the important production data on a display. Various menus allow the operator to monitor or optimize the process. 

Chip Testing & Taping System, Type CTTS

SMD-components with special test procedures or non standard dimension are measured and taped with the Chip Taping & Testing System CTTS. 

The Chip Testing & Taping System CTTS is a system to measure and tape SMD components. The parts are loaded from a bowl feeder via a linear feeding system into the test station. Chips out of the tolerance are dropped directly into the reject box. Good measured components are fed to the carrier tape by an index wheel. To ensure gapless taping, an optical sensor controls the loading of the chips into the tape. Leader, trailer, pre- and post-sealed pockets are programmable and automatically done by the machine. The machine is equipped with a hot sealing unit and a reel on unit. The machine is controlled by a microprocessor and the measuring device is connected via a digital IO-interface. The system can work in a taping or in a sorting mode. The CTTS is adaptable to different component sizes. Our standard models are for component sizes 1206, 0805 and 0603. Punched paper tape or embossed tape can be handled, an easy conversion to different sizes is possible.